Thinning the thickness of compound on packaged panel
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Application
Laser thinning, marking and sweeping on the compound surface of packaged IC panel.
Laser Type
- IR Laser
- Green Laser
- UV Laser
Specifications
- Single Laser Head
- Material warpage handling : 5.0 mm
- Accuracy: <±50um
Material Handling
- Fully automatic
- TRAY in/out
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Phone：15822884085
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