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Semiconductor

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Laser Thinning Machine

更新时间:2020-07-18 10:50:57

Thinning the thickness of compound on packaged panel

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Application
 
Laser thinning, marking and sweeping on the compound surface of packaged IC panel.
 
 
Laser Type
 
  • IR Laser
  • Green Laser
  • UV Laser
 
Specifications
 
  • Single Laser Head
  • Material warpage handling : 5.0 mm  
  • Accuracy: <±50um
 
Material Handling
 
  • Fully automatic
  • TRAY in/out


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CONTACT
  • Phone:15822884085
  • Email:business@rislaser.com
  • Adress:1F, Southeast of Building 1, 38 Beiguandu Road
    Suzhou 215104, PR China
Official account two-dimensional code

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