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LCM IC Package Micro Laser Processing System

更新时间:2020-06-17 14:46:22
Trench, Drilling and Cutting on the compound of Panel-Level Package.

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Application:
 
TMV drilling for POP and 2.5D packaging, trench for SiP EMI, or partial/full cutting for IC module (QFN, BGA etc.)
 
 
Laser Type:
 
  • Nano UV
 
 
Chracteristics:
 
  • 4-in-1 laser processing modules
  • arbitrary setting of cut/trench paths
  • auto load in/out with multi magazines
  • in-line AOI, barcode reader
  • Accuracy < ±10μm
 
 
Specifications:
 
  • size of workpiece 310x120 (max)
  • thickness of workpiece 2.0mm (max)
  • warpage allowance 7.0mm
  • accuracy CPK>1.67 @ tolerance ±10 um
 
 
Load/Unload:
 
  • magazine in/out

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CONTACT
  • Phone:15822884085
  • Email:business@rislaser.com
  • Adress:1F, Southeast of Building 1, 38 Beiguandu Road
    Suzhou 215104, PR China
Official account two-dimensional code

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