Trench, Drilling and Cutting on the compound of Panel-Level Package.
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Application:
TMV drilling for POP and 2.5D packaging, trench for SiP EMI, or partial/full cutting for IC module (QFN, BGA etc.)
Laser Type:
Chracteristics:
- 4-in-1 laser processing modules
- arbitrary setting of cut/trench paths
- auto load in/out with multi magazines
- in-line AOI, barcode reader
- Accuracy < ±10μm
Specifications:
- size of workpiece 310x120 (max)
- thickness of workpiece 2.0mm (max)
- warpage allowance 7.0mm
- accuracy CPK>1.67 @ tolerance ±10 um
Load/Unload:
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Phone：15822884085
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